6051 Polyimide Film
product descirption
polyimide film is synthesized by polymerizing PMDA and ODA in strong polar solvents through the process of forming film and imine treatment at high temperature.
Polyimide film Features
- Class H insulation (180 degree)
- Excellent physical, chemical, and electrical properties, atomic radiation resistant, solvent resistant, low & high temperature resistant. It performs successfully in the wide range of temperature as low as -452F (-269 degree) and as high as +500F (+260 degree).
Application:
This product can be used in coil insulation, flexible printed circuits and as insulating materials of flat electric cables, electromagnetic wires, transformers, capacitor and motors.
| Item |
Unit |
6051 GB/T13542.6-2006 IEC61074-2:1988 |
| Thickness |
um |
20 |
25 |
30 |
40 |
50 |
75 |
100 |
125 |
| Tolerance |
± |
3.0um |
4.0um |
5.0um |
7.5um |
10um |
12.5um |
| Density |
kg/cm3 |
1.42-1.49 |
| Tensile Strength |
MD |
MPa |
≥150 |
≥120 |
| TD |
≥120 |
| Elongation |
% |
≥50 |
≥60 |
| Electrical Strength |
V/um |
200 |
180 |
130 |
110 |
95 |
| Volume Resistivity |
Ω.M |
≥1.0*1013 |
| Surface Resistivity |
Ω |
≥1.0*1015 |
| Shrinkage(150ºC) |
% |
- |
≤0.2 |
| Dielectric Loss Factor(50Hz) |
- |
≤0.004 |
